Joining Processes - Couverture souple

D. Brandon, David

Couverture souple

ISBN 10 : 0471964883 ISBN 13 : 9780471964889

Editeur : John Wiley & Sons, 1997

Synopsis

This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.

A propos du livre

À propos de l?auteur

David Brandon, Technion, Israel Institute of Technology, Israel, is the author of Joining Processes: An Introduction, published by Wiley.

Wayne D. Kaplan, Technion, Israel Institute of Technology, Israel, is the author of Joining Processes: An Introduction, published by Wiley.

Détails de l'édition

• Éditeur: John Wiley & Sons
• Date d'édition: 1997
• Langue: anglais
• ISBN 10: 0471964883
• ISBN 13: 9780471964889
• Reliure: Broché
• Nombre de pages: 380
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible