Next Generation Wireless LANs: Throughput, Robustness, and Reliability in 802.11n - Couverture rigide

Perahia, Eldad; Stacey, Robert

 
9780521885843: Next Generation Wireless LANs: Throughput, Robustness, and Reliability in 802.11n
Couverture rigide
ISBN 10 : 0521885841 ISBN 13 : 9780521885843
Editeur : Cambridge University Press, 2008

Synopsis

This comprehensive overview brings practitioners, students and researchers quickly up to speed on the IEEE 802.11n standard.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos des auteurs

Eldad Perahia is a member of the Wireless Standards and Technology group at Intel Corporation, Chair of the IEEE 802.11 Very High Throughput Study Group, and the IEEE 802.11 liaison to IEEE 802.19. Prior to joining Intel, Dr. Perahia was the 802.11n lead for Cisco Systems. He was awarded his Ph.D. in Electrical Engineering from the University of California, Los Angeles and has fourteen patents in various areas of wireless communications.

Robert Stacey works in Intel Corporation's Wireless Standards and Technology group. He was a member of the 802.11 high throughput task group (TGn) and a key contributor to the various proposals culminating in the final joint proposal submission that became the basis for the 802.11n draft standard and has numerous patents filed in the field of wireless communications.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Cambridge University Press
Date d'édition
2008
Langue
anglais
ISBN 10 
0521885841
ISBN 13 
9780521885843
Reliure
Relié
Numéro d'édition
1
Nombre de pages
416
Coordonnées du fabricant
non disponible
Personne responsable
Avery
https://www.avery.fr/

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