Advances in Cryogenic Engineering Materials: Transactions of the International Cryogenic Materials Conference - ICMC - Couverture rigide

Couverture rigide

ISBN 10 : 0735405050 ISBN 13 : 9780735405059

Editeur : American Institute of Physics, 2008

Synopsis

All papers have been peer-reviewed. The 2007 joint Cryogenic Engineering Conference and International Cryogenic Materials Conference (CEC-ICMC) was held at the Chattanooga Convention Center in Chattanooga, TN, from July 16th through 20th. Nearly 700 attendees from 28 countries came together to enjoy the joint technical programs, industrial exhibit, and special events. There were 382 papers presented in plenary, oral, and poster sessions. Papers in the ICMC part of the conference covered the physical and mechanical properties of metals & alloys at cryogenic temperatures, insulation materials used in magnets for large-scale applications, recent developments in the conventional low-temperature superconductors, YBCO coated conductors, Bi-based superconductors, and MgB2 conductors. Conductor stability & AC losses as well as superconductor applications were also covered at this conference. ICMC papers selected after peer review process are published by AIP as "Conference Proceedings" Volume 986. Readers will get the latest information on materials and their properties used in cryogenic temperatures in this volume.

Détails de l'édition

• Éditeur: American Institute of Physics
• Date d'édition: 2008
• Langue: anglais
• ISBN 10: 0735405050
• ISBN 13: 9780735405059
• Reliure: Relié
• Nombre de pages: 584
• Éditeur: Balachandran Balu, Amm Kathleen, Evans David, Gregory Eric, Osofsky Mike, Pamidi Sastry, Park Chan, Wu Judy, Sumption Mike
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible