Characterization of Integrated Circuit Packaging Materials - Couverture rigide

Moore, Thomas M.; Mckenna, Robert G.

Couverture rigide

ISBN 10 : 0750692677 ISBN 13 : 9780750692670

Editeur : Butterworth-Heinemann Ltd, 1993

Synopsis

Addresses methods for measuring the properties of IC packages. Chapters include examples of the different analytical techniques used to measure the IC characteristics, and how to identify problems in IC packaging.

A propos du livre

Présentation de l'éditeur

With a particular emphasis on fabrication quality control, this volume in the "Materials Characterization" series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. The readers will find: general overview of IC package reliability testing; characterization for the electrical performance of IC packages; understanding surface characteristics and interfaces for thermal management; and concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.

Détails de l'édition

• Éditeur: Butterworth-Heinemann Ltd
• Date d'édition: 1993
• Langue: anglais
• ISBN 10: 0750692677
• ISBN 13: 9780750692670
• Reliure: Relié
• Nombre de pages: 292
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible