Advances in Thermal Modeling of Electronic Components and Systems - Couverture rigide

 
9780791800157: Advances in Thermal Modeling of Electronic Components and Systems
Couverture rigide
ISBN 10 : 0791800156 ISBN 13 : 9780791800157
Editeur : American Society of Mechanical Engineers,U.S., 1990

Synopsis

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

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Éditeur
American Society of Mechanical Engineers,U.S.
Date d'édition
1990
Langue
anglais
ISBN 10 
0791800156
ISBN 13 
9780791800157
Reliure
Relié
Éditeur
Bar-Cohen Avram
Coordonnées du fabricant
non disponible
Personne responsable
non disponible