Electrothermal Analysis of Vlsi Systems - Couverture rigide

Yi-Kan Cheng; Ching-Han Tsai; Chin-Chi Teng; Sung-Mo (Steve) Kang

Couverture rigide

ISBN 10 : 079237861X ISBN 13 : 9780792378617

Editeur : Kluwer Academic Publishers, 2000

Synopsis

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

Détails de l'édition

• Éditeur: Kluwer Academic Publishers
• Date d'édition: 2000
• Langue: anglais
• ISBN 10: 079237861X
• ISBN 13: 9780792378617
• Reliure: Relié
• Nombre de pages: 210
• Coordonnées du fabricant: Springer-Verlag GmbH; customerservice@springernature.com; ; Tiergartenstraße 17; Heidelberg; Baden-Württemberg; 69121; Allemagne