Interconnects in VLSI Design - Couverture rigide

Couverture rigide

ISBN 10 : 0792379977 ISBN 13 : 9780792379973

Editeur : Kluwer Academic Publishers, 2000

Synopsis

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua- tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des- cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Détails de l'édition

• Éditeur: Kluwer Academic Publishers
• Date d'édition: 2000
• Langue: anglais
• ISBN 10: 0792379977
• ISBN 13: 9780792379973
• Reliure: Relié
• Nombre de pages: 236
• Éditeur: Grabinski Hartmut
• Coordonnées du fabricant: Springer-Verlag GmbH; customerservice@springernature.com; ; Tiergartenstraße 17; Heidelberg; Baden-Württemberg; 69121; Allemagne