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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis - Couverture rigide

Livre 24 sur 115: Mechanical Engineering

Jamnia, Ali

 
9780824708658: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis
Couverture rigide
ISBN 10 : 0824708652 ISBN 13 : 9780824708658
Editeur : Marcel Dekker Inc, 2002

Synopsis

Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.

Practical Guide to the Packaging of Electronics discusses

  • Packaging/enclosure design and reliability
  • Thermal, junction-to-case, and contact interface resistance
  • Direct and indirect flow system design
  • Fin design and fan selection
  • Vital elements of shock and vibration
  • Thermal stresses and strains in the design and analysis of mechanically reliable systems
  • Reliability models and system failure
  • The selection of engineering software to facilitate system analysis
  • Design parameters in an avionics electronics package

    Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

    • Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

    Présentation de l'éditeur

    Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.

    Practical Guide to the Packaging of Electronics discusses

  • Packaging/enclosure design and reliability
  • Thermal, junction-to-case, and contact interface resistance
  • Direct and indirect flow system design
  • Fin design and fan selection
  • Vital elements of shock and vibration
  • Thermal stresses and strains in the design and analysis of mechanically reliable systems
  • Reliability models and system failure
  • The selection of engineering software to facilitate system analysis
  • Design parameters in an avionics electronics package

    Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

    • Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

    Éditeur
    Marcel Dekker Inc
    Date d'édition
    2002
    Langue
    anglais
    ISBN 10 
    0824708652
    ISBN 13 
    9780824708658
    Reliure
    Relié
    Nombre de pages
    224
    Coordonnées du fabricant
    non disponible
    Personne responsable
    non disponible