Microelectronic Packaging Technology: Materials and Processes : Proceedings of the 2nd Asm International Electronic Materials and Processing Congres - Couverture rigide
Synopsis
Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno
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