Microelectronic Failure Analysis: Desk Reference - Couverture rigide

Boit, Christian

Couverture rigide

ISBN 10 : 0871706385 ISBN 13 : 9780871706386

Editeur : ASM International, 2002

Synopsis

Developments over the past six years have been covered in this expanded text, while previously covered topics have been revisited with a fresh perspective. New material includes fault isolation and characterization, as well as state-of-the-art techniques to analyze the die from the backside. This updated reference book, prepared by experts in their fields, contains 60 articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most frequently needed information on this subject at your fingertips. Contents: Overall View of Failure Analysis of Microelectronic Devices Test-and-Fail Verification Decapsulation and Package Analysis Electrical Techniques Electron/ Ion-Beam Based Techniques Thermal Techniques Photonic Techniques Soft-ware Techniques Deprocessing and Sample Preparation Physical / Chemical Defect Characterization Discrete / Passive Component Analysis Failure Modes and Mechanisms Advance Techniques Laboratory Operations and Management.

Détails de l'édition

• Éditeur: ASM International
• Date d'édition: 2002
• Langue: anglais
• ISBN 10: 0871706385
• ISBN 13: 9780871706386
• Reliure: Relié
• Numéro d'édition: 4
• Nombre de pages: 644
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible