Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science - Couverture rigide

Harman, George

9780930815257: Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Couverture rigide

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Editeur : Intl Society of Hybrid, 1989

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�diteur: Intl Society of Hybrid
Date d'�dition: 1989
Langue: anglais
ISBN 10: 0930815254
ISBN 13: 9780930815257
Reliure: Reli�
Coordonn�es du fabricant: non disponible
Personne responsable: non disponible

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

George Harman

Edit� par Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

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Etat : Very Good. Very Good condition. A copy that may have a few cosmetic defects. May also contain light spine creasing or a few markings such as an owner's name, short gifter's inscription or light stamp. N� de r�f. du vendeur U09B-05303

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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science

Harman, George G.

Edit� par International Society for Hybrid Microelectronics, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

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Vendeur : Better World Books: West, Reno, NV, Etats-Unis

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Etat : Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. N� de r�f. du vendeur 10163251-75

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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science

Harman, George G.

Edit� par International Society for Hybrid Microelectronics, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Ancien ou d'occasion Couverture rigide

Vendeur : Better World Books, Mishawaka, IN, Etats-Unis

�valuation du vendeur 5 sur 5 �toiles

Etat : Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. N� de r�f. du vendeur 5475174-6

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Harman, George

Edit� par Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Ancien ou d'occasion Couverture rigide

Vendeur : HPB-Red, Dallas, TX, Etats-Unis

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Hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! N� de r�f. du vendeur S_322936498

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

George Harman

Edit� par Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Ancien ou d'occasion Couverture rigide

Vendeur : ThriftBooks-Atlanta, AUSTELL, GA, Etats-Unis

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Hardcover. Etat : Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. N� de r�f. du vendeur G0930815254I3N00

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Harman, George

Edit� par Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Ancien ou d'occasion Couverture rigide

Vendeur : Bingo Books 2, Vancouver, WA, Etats-Unis

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Hardcover. Etat : Fine. hardback book in fine condition. N� de r�f. du vendeur 123284

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Harman, George

Edit� par Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Ancien ou d'occasion Couverture rigide

Vendeur : Bingo Books 2, Vancouver, WA, Etats-Unis

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Hardcover. Etat : Fine. hardback book in fine condition. N� de r�f. du vendeur 122444

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1989 HC Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Harman, George

Edit� par Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Ancien ou d'occasion Couverture rigide

Vendeur : Miki Store, San Jose, CA, Etats-Unis

�valuation du vendeur 5 sur 5 �toiles

hardcover. Etat : Very Good. Etat de la jaquette : DUST JACKET. Pages are crisp and clean, no marking. Cover is verygood. Binding is tight/good. N� de r�f. du vendeur hb-bs23

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Harman, George

Edit� par Intl Society of Hybrid, 1989

ISBN 10 : 0930815254 ISBN 13 : 9780930815257

Neuf Couverture rigide

Vendeur : BennettBooksLtd, Los Angeles, CA, Etats-Unis

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Hardcover. Etat : New. In shrink wrap. Looks like an interesting title! N� de r�f. du vendeur Q-0930815254

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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science - Couverture rigide

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