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Materials and processes for microwave hybrids
Edité par
International Society for Hybrid, 1991
ISBN 10 : 0930815319
ISBN 13 : 9780930815318
Ancien ou d'occasion
Couverture rigide
Vendeur : Bookmans, Tucson, AZ, Etats-Unis
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Hardcover. Etat : Good. Satisfaction 100% guaranteed. N° de réf. du vendeur mon0001804215
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EUR 37,85
Expédition à EUR 3,41
Expédition nationale : Etats-Unis
Expédition nationale : Etats-Unis
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materials and processes for microwave hybrids
Edité par
international society for hybrid microelectronics, 1991
ISBN 10 : 0930815319
ISBN 13 : 9780930815318
Ancien ou d'occasion
Couverture rigide
Edition originale
Vendeur : Bingo Books 2, Vancouver, WA, Etats-Unis
Évaluation du vendeur 4 sur 5 étoiles
Hardcover. Etat : Near Fine. 1st Edition. hardback book in near fine condition. N° de réf. du vendeur 126066
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EUR 54,64
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Expédition nationale : Etats-Unis
Expédition nationale : Etats-Unis
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Materials And Processes For Microwave Hybrids
Edité par
International Society For Hybrid Microelectronics, Reston, VA, 1991
ISBN 10 : 0930815319
ISBN 13 : 9780930815318
Ancien ou d'occasion
Couverture rigide
Edition originale
Signé
Vendeur : Ground Zero Books, Ltd., Silver Spring, MD, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Hardcover. Etat : Good. x, 294 pages. Figures. Formulae. Tables. References. Index. Name of previous owner in ink on fore-edge. Inscribed sentiment by the author on the fep. Sentiment reads With the author's compliments. Some spine sunning noted. Richard Brown 2/10/94. No dust jacket present. This is a Technical Monograph for the International Society for Hybrid Microelectronics. In 1991 this author published a monograph based on his experience teaching microwave hybrid materials and processing technology at the annual ISHM (now the International Microelectronics and Packaging Society, IMAPS) symposia. Since that time, the course has been presented at that venue and on-site at a number of industrial and government organizations. The course has been continually revised to reflect the many evolutionary changes in materials and processes. Microwave technology has existed for almost 175 years. It was only after the invention of the klystron, just before World War II, that microwave design and manufacture moved from a few visionaries to the growth the industry sees today. Over the last decade alone there have been exploding applications for all types of high frequency electronics in the military, automotive, wireless, computer, telecommunications and medical industries. These have placed demands, unimaginable a decade ago, on designs, materials, processes and equipment to meet the ever expanding requirements for increasingly reliable, smaller, faster and lower cost circuits. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Hybrid circuits could be encapsulated in epoxy or in military and space applications, a lid was soldered onto the package. A hybrid circuit serves as a component on a PCB in the same way as a monolithic integrated circuit; the difference between the two types of devices is in how they are constructed and manufactured. The advantage of hybrid circuits is that components which cannot be included in a monolithic IC can be used, e.g., capacitors of large value, wound components, crystals, inductors. In military and space applications, numerous integrated circuits, transistors and diodes, in their die form, would be placed on either a ceramic or beryllium substrate. Either gold or aluminum wire would be bonded from the pads of the IC, transistor, or diode to the substrate. Thick film technology is often used as the interconnecting medium for hybrid integrated circuits. The use of screen printed thick film interconnect provides advantages of versatility over thin film although feature sizes may be larger and deposited resistors wider in tolerance. Multi-layer thick film is a technique for further improvements in integration using a screen printed insulating dielectric to ensure connections between layers are made only where required. One key advantage for the circuit designer is complete freedom in the choice of resistor value in thick film technology. Planar resistors are also screen printed and included in the thick film interconnect design. The composition and dimensions of resistors can be selected to provide the desired values. The final resistor value is determined by design and can be adjusted by laser trimming. Once the hybrid circuit is fully populated with components, fine tuning prior to final test may be achieved by active laser trimming. Thin film technology was also employed in the 1960s. Ultra Electronics manufactured circuits using a silica glass substrate. A film of tantalum was deposited by sputtering followed by a layer of gold by evaporation. The gold layer was first. N° de réf. du vendeur 86847
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EUR 110,15
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Expédition nationale : Etats-Unis
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