Materials in Microelectronic and Optoelectronic Packaging - Couverture rigide

9780944904633: Materials in Microelectronic and Optoelectronic Packaging

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ISBN 10 : 0944904637 ISBN 13 : 9780944904633

Editeur : American Ceramic Society, 1993

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D�tails de l'�dition

�diteur: American Ceramic Society
Date d'�dition: 1993
Langue: anglais
ISBN 10: 0944904637
ISBN 13: 9780944904633
Reliure: Reli�
Nombre de pages: 471
�diteur: Ling Hung C.
Coordonn�es du fabricant: non disponible
Personne responsable: non disponible

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Materials in Microelectronic and Optoelectronic Packaging. Ceramic Transactions Volume 33

Hung C. Ling

Edit� par Columbus: The American Ceramic Society, 1993

ISBN 10 : 0944904637 ISBN 13 : 9780944904633

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Etat : Fine. *Price HAS BEEN REDUCED by 10% until Monday, May 18 (weekend sale item)* 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. N� de r�f. du vendeur ZB329939

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