Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Couverture rigide

Cepeda-Rizo, Juan; Gayle, Jeremiah; Ravich, Joshua

 
9781032160818: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Couverture rigide
ISBN 10 : 1032160810 ISBN 13 : 9781032160818
Editeur : CRC Press, 2021

Synopsis

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Juan Cepeda-Rizo obtained his bachelor's degree in mechanical engineering and master's in materials engineering from Cal Poly, San Luis Obispo in 1997. After graduation he worked for a semiconductor company doing electronic packaging analysis. He received his Ph.D. from Claremont Graduate University in Applied Mathematics in and in 2008 worked for NASA's Jet Propulsion Laboratory as a thermal system engineer where his latest responsibilities included thermal and structural analysis of flight electronics.

Jeremiah Gayle obtained his bachelor's degree in mechanical engineering from Arizona State University, and master's degrees from Iowa State, and John Hopkins University in space systems engineering. He is pursuing a doctorate in aerospace engineering from Colorado State University and works at NASA's Jet Propulsion Laboratory where he works on spacecraft systems and conducts thermal and structural analysis of avionics.

Joshua Ravich is a supervisor for the Technology Infusion group at JPL, where he works on the mechanical design and analysis of spacecraft systems. His recent work has included the Mars Helicopter project. He received a bachelor's degree in mechanical Engineering from UC Berkeley and a master's in mechanical and aerospace engineering from the University of Michigan.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
CRC Press
Date d'édition
2021
Langue
anglais
ISBN 10 
1032160810
ISBN 13 
9781032160818
Reliure
Relié
Nombre de pages
304
Coordonnées du fabricant
non disponible
Personne responsable
gpsr@libri.de
gpsr@libri.de

Friedensallee 273
Hamburg
22763
Allemagne

Autres éditions populaires du même titre

9781032160856: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Edition présentée

ISBN 10 :  1032160853 ISBN 13 :  9781032160856
Editeur : CRC Press, 2024
Couverture souple