Artificial Intelligence Solutions for Cyber-physical Systems - Couverture souple

Couverture souple

ISBN 10 : 103269436X ISBN 13 : 9781032694368

Editeur : Auerbach, 2026

Synopsis

Smart manufacturing environments are revolutionizing the industrial sector by integrating advanced technologies, such as the Internet of Things (IoT), artificial intelligence (AI), and robotics, to achieve higher levels of efficiency, productivity, and safety. However, the increasing complexity and interconnectedness of these systems also introduce new security challenges that must be addressed to ensure the safety of human workers and the integrity of manufacturing processes. Key topics include risk assessment methodologies, secure communication protocols, and the development of standard specifications to guide the design and implementation of HCPS. Recent research highlights the importance of adopting a multi-layered approach to security, encompassing physical, network, and application layers. Furthermore, the integration of AI and machine learning techniques enables real-time monitoring and analysis of system vulnerabilities, as well as the development of adaptive security measures.

Artificial Intelligence Solutions for Cyber-Physical Systems discusses such best practices and frameworks as NIST Cybersecurity Framework, ISO/IEC 27001, and IEC 62443 of advanced technologies. It presents strategies and methods to mitigate risks and enhance security, including cybersecurity frameworks, secure communication protocols, and access control measures. The book also focuses on the design, implementation, and management of secure HCPS in smart manufacturing environments. It covers a wide range of topics, including risk assessment, security architecture, data privacy, and standard specifications, for HCPS. The book highlights the importance of securing communication protocols, the role of artificial intelligence and machine learning in threat detection and mitigation, and the need for robust cybersecurity frameworks in the context of smart manufacturing.

A propos du livre

À propos de l?auteur

Pushan Kumar Dutta is Assistant Professor Grade III in the Electronics and Communication Engineering Department of ASETK in Amity University, Kolkata, India.

Pethuru Raj is Chief Architect at Reliance Jio Platforms Ltd. (JPL) Bangalore, India.

B. Sundaravadivazhagan is an experienced researcher and educator in the field of information and communication engineering.

Chithirai Pon Selvan has extensive experience in teaching engineering students and has worked in academia for over 23 years.

Détails de l'édition

• Éditeur: Auerbach
• Date d'édition: 2026
• Langue: anglais
• ISBN 10: 103269436X
• ISBN 13: 9781032694368
• Reliure: Broché
• Nombre de pages: 452
• Éditeur: Dutta Pushan Kumar, Raj Pethuru, Sundaravadivazhagan B., Selvan CHITHIRAI PON
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible