Recent Trends in Vlsi and Semiconductor Packaging - Couverture souple

Couverture souple

ISBN 10 : 1041017871 ISBN 13 : 9781041017875

Editeur : CRC Press, 2025

Synopsis

The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.

A propos du livre

À propos de l?auteur

T. Vasudeva Reddy is an Associate Professor in Electronics and Communication Engineering (ECE), B V RAJU Institute of Technology, Narsapur. His expertise lies in enhancing electronic system efficiency, focusing on power consumption, area utilization, and signal delay optimization. His research encompasses Low Power SRAM Architectures, Sub-threshold SRAM Designs, and MEMS Devices for Coagulation Effect, supported by a rich publication record and a commitment to innovative research.

K. Madhava Rao, Assistant Professor at B V RAJU Institute of Technology, Narsapur since 2016, boasts a comprehensive exploration and contribution to electronics and communication engineering. His research covers hardware implementation, low-power techniques, FPGA-based systems, and advanced memory designs, presented at international conferences and esteemed journals.

Détails de l'édition

• Éditeur: CRC Press
• Date d'édition: 2025
• Langue: anglais
• ISBN 10: 1041017871
• ISBN 13: 9781041017875
• Reliure: Broché
• Nombre de pages: 616
• Éditeur: Reddy T. Vasudeva, Rao K. Madhava
• Coordonnées du fabricant: CRC Press; https://www.routledge-ny.com; ; 6000 BROKEN SOUND PARKWAY, NW SUITE 300; BOCA RATON; FL; 33487; Etats-Unis
• Personne responsable: gpsr@libri.de; gpsr@libri.de; ; Friedensallee 273; Hamburg; 22763; Allemagne