Articles liés à Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging - Couverture souple

 
9781041017875: Recent Trends in VLSI and Semiconductor Packaging
Couverture souple
ISBN 10 : 1041017871 ISBN 13 : 9781041017875
Editeur : CRC Press, 2025

Synopsis

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l'auteur

T. Vasudeva Reddy is an Associate Professor in Electronics and Communication Engineering (ECE), B V RAJU Institute of Technology, Narsapur. His expertise lies in enhancing electronic system efficiency, focusing on power consumption, area utilization, and signal delay optimization. His research encompasses Low Power SRAM Architectures, Sub-threshold SRAM Designs, and MEMS Devices for Coagulation Effect, supported by a rich publication record and a commitment to innovative research.

K. Madhava Rao, Assistant Professor at B V RAJU Institute of Technology, Narsapur since 2016, boasts a comprehensive exploration and contribution to electronics and communication engineering. His research covers hardware implementation, low-power techniques, FPGA-based systems, and advanced memory designs, presented at international conferences and esteemed journals.

À propos de la quatrième de couverture

The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
CRC Press
Date d'édition
2025
Langue
anglais
ISBN 10 
1041017871
ISBN 13 
9781041017875
Reliure
Broché
Nombre de pages
648
Éditeur
Reddy T. Vasudeva, Rao K. Madhava
Coordonnées du fabricant
CRC Press
https://www.routledge-ny.com

6000 BROKEN SOUND PARKWAY, NW SUITE 300
BOCA RATON
FL
33487
Etats-Unis
Personne responsable
gpsr@libri.de
gpsr@libri.de

Europaallee 1
Bad Hersfeld
36244
Allemagne