9781107003781: LCP for Microwave Packages and Modules

Synopsis

A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels.

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À propos des auteurs

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012.

Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

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