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Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics - Couverture souple

Oehrlein, G. S.

 
9781107413153: Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics
Couverture souple
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Editeur : Cambridge University Press, 2014

Synopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Cambridge University Press
Date d'édition
2014
Langue
anglais
ISBN 10 
110741315X
ISBN 13 
9781107413153
Reliure
Broché
Nombre de pages
612
Coordonnées du fabricant
non disponible
Personne responsable
Avery
https://www.avery.fr/

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