Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics - Couverture souple

Oehrlein, G. S.

Couverture souple

ISBN 10 : 110741315X ISBN 13 : 9781107413153

Editeur : Cambridge University Press, 2014

Synopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

A propos du livre

Présentation de l'éditeur

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

Détails de l'édition

• Éditeur: Cambridge University Press
• Date d'édition: 2014
• Langue: anglais
• ISBN 10: 110741315X
• ISBN 13: 9781107413153
• Reliure: Broché
• Nombre de pages: 612
• Coordonnées du fabricant: non disponible
• Personne responsable: Avery; https://www.avery.fr/; ; chemin des peupliers 27; Dardilly; France