Silicon Front-End Technology ― Materials Processing and Modelling: Volume 532 - Couverture souple

Couverture souple

ISBN 10 : 1107413729 ISBN 13 : 9781107413726

Editeur : Cambridge University Press, 2014

Synopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

A propos du livre

Présentation de l'éditeur

As silicon-integrated circuit technology enters the sub-100nm realm, continued progress will depend on a fundamental understanding of the physics of materials processing. The high cost of processing experimental lots and the speed at which new devices brought to the market have created a new emphasis on realistic physical models incorporated in technology CAD (TCAD) simulation tools. The book brings together researchers to review recent developments in the integrated-circuit community and to identify key issues for future research in this field. Results of research on the physical mechanisms involved in silicon device processing are presented both from experimental and theoretical viewpoints. The application of this research to TCAD process simulation models is also addressed. Topics include: shallow junctions and transient enhanced diffusion; extended defects and transient enhanced diffusion; impurities and point defects; implant technology, thin films and surfaces and point defects and diffusion in SiGe.

Détails de l'édition

• Éditeur: Cambridge University Press
• Date d'édition: 2014
• ISBN 10: 1107413729
• ISBN 13: 9781107413726
• Reliure: Broché
• Langue: anglais
• Nombre de pages: 244
• Éditeur: Cowern Nicholas E. B., Jacobson Dale C., Griffin Peter B., Packan Paul A., Webb Roger P.
• Coordonnées du fabricant: non disponible