Articles liés à Wireless Interface Technologies for 3D IC and Module...

Wireless Interface Technologies for 3D IC and Module Integration - Couverture rigide

Kuroda, Tadahiro; Yip, Wai-Yeung

 
9781108841214: Wireless Interface Technologies for 3D IC and Module Integration
Couverture rigide
ISBN 10 : 110884121X ISBN 13 : 9781108841214
Editeur : Cambridge University Press, 2021

Synopsis

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos des auteurs

Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE.

Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Cambridge University Press
Date d'édition
2021
Langue
anglais
ISBN 10 
110884121X
ISBN 13 
9781108841214
Reliure
Relié
Nombre de pages
300
Coordonnées du fabricant
non disponible
Personne responsable
Avery
https://www.avery.fr/

chemin des peupliers 27
Dardilly
France