Thermal Management for Opto-Electronics Packaging and Applications - Couverture rigide

Luo, Xiaobing; Hu, Run; Xie, Bin

 
9781119179276: Thermal Management for Opto-Electronics Packaging and Applications

Synopsis

"LEDs are prevalent in our daily lives and can be found in consumer electronics such as phones, computers, TVs, digital cameras and so on. LEDs, with the advantages of high efficiency, compact size, low power consumption and high reliability, are now widely recognized as the fourth illumination source that would substitute its predecessors: incandescent, fluorescent, and high pressure sodium lamps. Due to the increased demand, the power of these LED products inevitably becomes larger whilst its volume decreases. The resultant increased heat flux is thus a significant challenge for the further development of LED technologies, and is something this book tackles with its thermal management strategies."--

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À propos de l?auteur

Xiaobing Luo, PhD, is a Full Professor at School of Energy and Power Engineering, Huazhong University of Science and Technology, China. He is IEEE Fellow and ASME Fellow. He has extensive research experience in thermal management field. He has published more than 200 academic papers and invented novel micro hydraulic suspension pump for liquid cooling system.

Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province.

Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).

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