Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package - Couverture rigide

 
9781119793779: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package
Couverture rigide
ISBN 10 : 1119793777 ISBN 13 : 9781119793779
Editeur : Wiley-IEEE Press, 2021

Synopsis

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies

In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches.

The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Beth Keser, PhD, is an IEEE Fellow and Distinguished Lecturer with over 23 years' experience in the semiconductor industry and a co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Beth's excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 30 patents and patents pending and over 50 publications in the semiconductor industry.

Steffen Kröhnert is President & Founder of ESPAT-Consulting in Dresden, Germany. He is member of IEE EPS and co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Steffen has over 20 years' experience in the semiconductor industry and is the author or co-author of 23 patent filings.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Wiley-IEEE Press
Date d'édition
2021
Langue
anglais
ISBN 10 
1119793777
ISBN 13 
9781119793779
Reliure
Relié
Nombre de pages
320
Éditeur
Keser Beth, Krouml, hnert Steffen
Coordonnées du fabricant
non disponible
Personne responsable
Buchpark GmbH
gpsr@buchpark.de

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