"Reuse Methodology Manual for System-on-a-Chip Designs, Third Edition" outlines a set of best practices for creating reusable designs for use in an SoC design methodology. These practices are based on the authors' experience in developing reusable designs, as well as the experience of design teams in many companies around the world. Silicon and tool technologies move so quickly that many of the details of design-for-reuse will undoubtedly continue to evolve over time. But the fundamental aspects of the methodology described in this book have become widely adopted and are likely to form the foundation of chip design for some time to come. Development methodology necessarily differs between system designers and processor designers, as well as between DSP developers and chipset developers. However, there is a common set of problems facing everyone who is designing complex chips. In response to these problems, design teams have adopted a block-based design approach that emphasizes design reuse. Reusing macros (sometimes called "cores") that have already been designed and verified helps to address all of the problems above. However, in adopting reuse-based design, design teams have run into a significant problem. Reusing blocks that have not been explicitly designed for reuse has often provided little or no benefit to the team. The effort to integrate a pre-existing block into new designs can become prohibitively high, if the block does not provide the right views, the right documentation, and the right functionality. From this experience, design teams have realized that reuse-based design requires an explicit methodology for developing reusable macros that are easy to integrate into SoC designs. This manual focuses on describing these techniques.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
EUR 29,72 expédition depuis Etats-Unis vers France
Destinations, frais et délaisEUR 25,47 expédition depuis Etats-Unis vers France
Destinations, frais et délaisVendeur : SecondSale, Montgomery, IL, Etats-Unis
Etat : Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc. N° de réf. du vendeur 00059520847
Quantité disponible : 2 disponible(s)
Vendeur : Florida Mountain Book Co., Datil, NM, Etats-Unis
Etat : Near Fine. Hardcover, [xviii], 291 pages. Near Fine condition. Third edition. Size 9.5"x6.25". "Silicon and tool technologies move so quickly that many of the details of design-for-reuse will undoubtedly continue to evolve over time. But the fundamental aspects of the methodology described in this book have become widely adopted and are likely to form the foundation of chip design for some time to come. . . . Features of the Third Edition: Up to date; State of the art; Reuse as a solution for circuit designers; A chronicle of 'best practices'; All chapters updated and revised; Generic guidelines - non tool specific; Emphasis on hard IP and physical design." Book has light exterior shelfwear. Previous owner's name blacked-out on top edge, text else Fine condition, clean and unmarked. N° de réf. du vendeur 009472
Quantité disponible : 1 disponible(s)
Vendeur : Toscana Books, AUSTIN, TX, Etats-Unis
Hardcover. Etat : new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks. N° de réf. du vendeur Scanned1402071418
Quantité disponible : 1 disponible(s)
Vendeur : HPB-Red, Dallas, TX, Etats-Unis
hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! N° de réf. du vendeur S_390361561
Quantité disponible : 1 disponible(s)