Interconnect Technology and Design for Gigascale Integration - Couverture rigide

Couverture rigide

ISBN 10 : 1402076061 ISBN 13 : 9781402076060

Editeur : Kluwer Academic Publishers, 2003

Synopsis

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.

Détails de l'édition

• Éditeur: Kluwer Academic Publishers
• Date d'édition: 2003
• Langue: anglais
• ISBN 10: 1402076061
• ISBN 13: 9781402076060
• Reliure: Relié
• Nombre de pages: 424
• Éditeur: Davis Jeffrey A., Meindl James D.
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne