Articles liés à Spice Based Heat Transport Model for Non-Intrusive...

Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications - Couverture souple

Stelzer, Michael A.

 
9781419606137: Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications
Couverture souple
ISBN 10 : 1419606131 ISBN 13 : 9781419606137
Editeur : BookSurge Publishing, 2005

Synopsis

This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
BookSurge Publishing
Date d'édition
2005
Langue
anglais
ISBN 10 
1419606131
ISBN 13 
9781419606137
Reliure
Broché
Nombre de pages
160
Coordonnées du fabricant
Manufactured by Amazon on behalf of the author
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