Interconnect Noise Optimization in Nanometer Technologies - Couverture souple

Elgamel, Mohamed; Bayoumi, Magdy A.

Couverture souple

ISBN 10 : 1441938443 ISBN 13 : 9781441938442

Editeur : Springer, 2010

Synopsis

This book provides insight into the use of CAD for layout analysis and optimization of interconnect in high speed, high complexity integrated circuits, which have become the dominating factor in determining system performance in nanometer technologies. The text investigates the effects on system performance and reliability of wire size, spacing, wire length, coupling length, load capacitance, rise time of the inputs, place of overlap, frequency, shields, signal direction and wire width for both the aggressors and the victim wires. The authors present a range of CAD algorithms and techniques for synthesizing and optimizing interconnect.

A propos du livre

Présentation de l'éditeur

Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2010
• Langue: anglais
• ISBN 10: 1441938443
• ISBN 13: 9781441938442
• Reliure: Broché
• Numéro d'édition: 1
• Nombre de pages: 160
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne