Benefiting from Thermal and Mechanical Simulation in Micro-Electronics - Couverture souple

Couverture souple

ISBN 10 : 1441948732 ISBN 13 : 9781441948731

Editeur : Springer, 2010

Synopsis

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are: -

The impact of simulation on industry profitability

Approaches to simulation

The state-of-the-art methodologies of simulation

Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2010
• Langue: anglais
• ISBN 10: 1441948732
• ISBN 13: 9781441948731
• Reliure: Broché
• Nombre de pages: 208
• Éditeur: Zhang G.Q., Ernst L.J., De Saint Leger O.
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne