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Synopsis
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
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Présentation de l'éditeur
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
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Springer (edition 2010), 2010
ISBN 10 : 1441957189
ISBN 13 : 9781441957184
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Hardcover. Etat : Fair. 2010. The item might be beaten up but readable. May contain markings or highlighting, as well as stains, bent corners, or any other major defect, but the text is not obscured in any way. N° de réf. du vendeur 1441957189-7-1
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
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Springer, 2010
ISBN 10 : 1441957189
ISBN 13 : 9781441957184
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Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presented in a systematic manner based on lectures and tutorials by the authorsFocused on improved reliability in plastic packagingProvides theory and new industry applicationsMoisture Sensitivity of Plastic Packages of IC Devices provides information o. N° de réf. du vendeur 4175871
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Moisture Sensitivity of Plastic Packages of IC Devices (Hardcover)
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Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10 : 1441957189
ISBN 13 : 9781441957184
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Hardcover. Etat : new. Hardcover. Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9781441957184
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
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Moisture Sensitivity of Plastic Packages of IC Devices
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Springer US Jul 2010, 2010
ISBN 10 : 1441957189
ISBN 13 : 9781441957184
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Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. 588 pp. Englisch. N° de réf. du vendeur 9781441957184
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
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Moisture Sensitivity of Plastic Packages of IC Devices
Edité par
Springer, 2010
ISBN 10 : 1441957189
ISBN 13 : 9781441957184
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Etat : As New. Unread book in perfect condition. N° de réf. du vendeur 19092328
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