Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support - Couverture rigide

Couverture rigide

ISBN 10 : 1441993673 ISBN 13 : 9781441993670

Editeur : Springer-Verlag New York Inc., 2011

Synopsis

The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling.

It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields.

This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications.

Détails de l'édition

• Éditeur: Springer-Verlag New York Inc.
• Date d'édition: 2011
• Langue: anglais
• ISBN 10: 1441993673
• ISBN 13: 9781441993670
• Reliure: Relié
• Nombre de pages: 451
• Éditeur: Borutzky Wolfgang
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne