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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Couverture souple
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The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped. N° de réf. du vendeur 4194152
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch. N° de réf. du vendeur 9781461359425
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science)
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Simulation Techniques and Solutions for Mixed-signal Coupling in Integrated Circuits
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch. N° de réf. du vendeur 9781461359425
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
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Springer US, Springer New York, 2012
ISBN 10 : 1461359422
ISBN 13 : 9781461359425
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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. N° de réf. du vendeur 9781461359425
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Simulation Techniques and Solutions for Mixed-signal Coupling in Integrated Circuits
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Springer, 2012
ISBN 10 : 1461359422
ISBN 13 : 9781461359425
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (Paperback)
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Paperback. Etat : new. Paperback. The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem.In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9781461359425
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science)
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (Paperback)
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Paperback. Etat : new. Paperback. The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem.In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. N° de réf. du vendeur 9781461359425
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