Articles liés à Solder Joint Reliability: Theory And Applications
Synopsis
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me- chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica- tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo- metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
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- ÉditeurSpringer
- Date d'édition2014
- ISBN 10 1461367433
- ISBN 13 9781461367437
- ReliureBroché
- Langueanglais
- Nombre de pages656
- Coordonnées du fabricantnon disponible
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Solder Joint Reliability : Theory and Applications
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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer. N° de réf. du vendeur 9781461367437
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Solder Joint Reliability: Theory and Applications
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer. 656 pp. Englisch. N° de réf. du vendeur 9781461367437
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Solder Joint Reliability: Theory and Applications
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Solder Joint Reliability: Theory and Applications
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ISBN 13 : 9781461367437
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