Semiconductors: Part I - Couverture souple

Couverture souple

ISBN 10 : 1461384095 ISBN 13 : 9781461384090

Editeur : Springer, 2011

Synopsis

Semiconductor and integrated-circuit modeling are an important part of the high-technology "chip" industry, whose high-performance, low-cost microprocessors and high-density memory designs form the basis for supercomputers, engineering workstations, laptop computers, and other modern information appliances. There are a variety of differential equation problems that must be solved to facilitate such modeling. This two-volume set covers three topic areas: process modeling and circuit simulation in Volume I and device modeling in Volume II. Process modeling provides the geometry and impurity doping characteristics that are prerequisites for device modeling; device modeling, in turn, provides static current and transient charge characteristics needed to specify the so-called compact models employed by circuit simulators. The goal of these books is to bring together scientists and mathematicians to discuss open problems, algorithms to solve such, and to form bridges between the diverse disciplines involved.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2011
• Langue: anglais
• ISBN 10: 1461384095
• ISBN 13: 9781461384090
• Reliure: Broché
• Nombre de pages: 184
• Éditeur: Coughran W.M. Jr., Cole Julian, Lloyd Peter, White Jacob K.
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne