Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Couverture souple

Liu, Yong

Couverture souple

ISBN 10 : 1461410541 ISBN 13 : 9781461410546

Editeur : Springer, 2012

Synopsis

Challenges of Power Electronic Packaging.- Power Package Electrical Isolation Design.- Discrete Power MOSFET Package Design and Analysis.- Power IC Packaging Design and Analysis.- Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations.- Thermal Management, Design and Cooling for Power Electronics.- Material Characterization for Power Electronics Packaging.- Power Package Typical Assembly Process.- Power Packaging Typical Reliability and Tests.- Power Packaging Modeling and Challenges.- Power Package Thermal and Mechanical Co-Design Simulation Automation.- Power Package Electrical and Multiple Physics Simulation.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2012
• Langue: anglais
• ISBN 10: 1461410541
• ISBN 13: 9781461410546
• Reliure: Taschenbuch
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne