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Fundamentals of Lead-free Solder Interconnect Technology: From Microstructures to Reliability - Couverture rigide

Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un; Ma, Hongtao

 
9781461492658: Fundamentals of Lead-free Solder Interconnect Technology: From Microstructures to Reliability

Synopsis

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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