Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Couverture souple
Synopsis
Preface. I: High Frequency Issues. 1. Tutorial On Microwave Concepts. 2. The Smith Chart and S-Parameters. II: Electrical Modeling of Packages. 3. Equivalent Circuit Models. 4. Creating Models from Measurements. 5. Creating a Model Using EM Simulators. III: Thermal Modeling. 6. Basics of Thermal Analysis. 7. Quick Thermal Analysis. 8. Finite Element Analysis. 9. Computational Fluid Dynamics. 10. Transient Thermal. 11. Thermal Measurement. IV: Processing Issues with Packaging GaAs High Frequency Components. 12. Package Families for Wireless. 13. Optimizing Electrical Performance. 14. Production Process Issues. 15. Die Attach Issues. Appendix A. Electrical Conductivities of Packaging Materials. Appendix B. Dielectric Properties of Packaging Materials. Appendix C. Thermal Conductivities of Packaging Materials. Appendix D. Thermal Modeling Software and Information. Appendix E. Thermal Analysis Equipment and Materials. Appendix F. Electromagnetic Simulator Software. Appendix G. Electrical Probing Tools. Appendix H. Circuit Simulator Software. Index.
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