Thermal Conductivity 15 - Couverture souple

Couverture souple

ISBN 10 : 146159085X ISBN 13 : 9781461590859

Editeur : Springer, 2013

Synopsis

Once again, it gives me a great pleasure to pen the Foreword to the Proceedings of the 15th International Conference on Thermal Conductivity. As in the past, these now biannual conferences pro- vide a broadly based forum for those researchers actively working on this important property of matter to convene on a regular basis to exchange their experiences and report their findings. As it is apparent from the Table of Contents, the 15th Conference represents perhaps the broadest coverage of subject areas to date. This is indicative of the times as the boundaries between disciplines be- come increasingly diffused. I am sure the time has come when Con- ference Chairmen in coming years will be soliciting contributions not only in the physical sciences and engineering', but will actively seek contributions from the earth sciences and life sciences as well. Indeed, the thermal conductivity and related properties of geological and biological materials are becoming of increasing im- portance to our way of life. As it can be seen from the summary table, unfortunately, proceedings have been published only for six of the fifteen con- ferences. It is hoped that hereafter this Series will become increasingly well known and be recognized as a major vehicle for the reporting of research on thermal conductivity.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2013
• Langue: anglais
• ISBN 10: 146159085X
• ISBN 13: 9781461590859
• Reliure: Broché
• Nombre de pages: 516
• Éditeur: Mirkovich V. V.
• Coordonnées du fabricant: non disponible
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