Thermal Conductivity 16 - Couverture souple

Couverture souple

ISBN 10 : 1468442678 ISBN 13 : 9781468442670

Editeur : Springer, 2012

Synopsis

The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer- ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon- sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex- change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth- er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2012
• Langue: anglais
• ISBN 10: 1468442678
• ISBN 13: 9781468442670
• Reliure: Broché
• Nombre de pages: 644
• Éditeur: Larsen David C.
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne