Materials - Couverture souple

Couverture souple

ISBN 10 : 147579052X ISBN 13 : 9781475790528

Editeur : Springer, 2013

Synopsis

The ninth International Cryogenic Materials Conference (ICMC) was held on the campus of the University of Alabama at Huntsville (UAH) in collaboration with the Cryogenic Engineering Conference (CEC) on June 11-14, 1991. The continuing bond between these two major conferences in the field of cryogenics is indicative of the extreme interdependence of their subject matter. The major purpose of the conference is sharing of the latest advances in low temperature materials science and technology. However, the many side benefits which accrue when this many experts gather, such as identification of new research areas, formation of new collaborations which often cross the boundaries of both scientific discipline and politics, and a chance for those new to the field to meet the old-timers, may override the stated purpose. This 1991 ICMC was chaired by F. R. Fickett of the National Institute of Standards and Technology. K. T. Hartwig, of Texas A&M served as Program Chairman with the assistance of eleven other Program Committee members. We especially appreciate the contributions of the CEC board and its Conference Chairman, J. Hendricks of Alabama Cryogenic Engineering, to the organization. of this joint conference. UAH hosted the conference. The local arrangements and management, under the watchful eye of Ann Yelle and Mary Beth Magathan of the UAH conference staff, were excellent. Participation in the CEC/ICMC continues to exceed expectations with 650 registrants for the combined conference.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2013
• Langue: anglais
• ISBN 10: 147579052X
• ISBN 13: 9781475790528
• Reliure: Broché
• Nombre de pages: 480
• Éditeur: Fickett F.R., Reed Richard P.
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne