Molecular Modeling and Multiscaling Issues for Electronic Material Applications - Couverture souple

Couverture souple

ISBN 10 : 1489988378 ISBN 13 : 9781489988379

Editeur : Springer, 2014

Synopsis

Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level.

A propos du livre

Présentation de l'éditeur

This book shows how molecular modeling is used to understand materials and solve relevant problems. Coverage includes attempts to reach the atomistic and submicron scales, the relationship between structures and mechanical performance of materials.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2014
• Langue: anglais
• ISBN 10: 1489988378
• ISBN 13: 9781489988379
• Reliure: Broché
• Nombre de pages: 272
• Éditeur: Iwamoto Nancy, Yuen Matthew M.F., Fan Haibo
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne