Synopsis
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications (eng)
impression à la demandeVendeur : Brook Bookstore On Demand, Napoli, NA, Italie
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Etat : new. Questo è un articolo print on demand. N° de réf. du vendeur 2658a289d2e22454bfd39ac63a412691
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Wafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications
Edité par
Springer New York, 2016
ISBN 10 : 1493954385
ISBN 13 : 9781493954384
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Couverture souple
Vendeur : Buchpark, Trebbin, Allemagne
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Etat : Sehr gut. Zustand: Sehr gut | Seiten: 340 | Sprache: Englisch | Produktart: Bücher | Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book. N° de réf. du vendeur 27014535/12
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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Vendeur : Revaluation Books, Exeter, Royaume-Uni
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Paperback. Etat : Brand New. reprint edition. 339 pages. 9.25x6.10x0.80 inches. In Stock. N° de réf. du vendeur zk1493954385
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Wafer-Level Chip-Scale Packaging
Edité par
Springer New York, 2016
ISBN 10 : 1493954385
ISBN 13 : 9781493954384
Neuf
Kartoniert / Broschiert
Vendeur : moluna, Greven, Allemagne
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Kartoniert / Broschiert. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the development of wafer level power discrete packaging with regular wafer level design concept and directly bumping technologyIntroduces the development of the analog and power SIP/3D/TSV/stack die packaging technologyPresents the w. N° de réf. du vendeur 458516105
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Wafer-Level Chip-Scale Packaging
Edité par
Springer New York, Chapman And Hall/CRC Aug 2016, 2016
ISBN 10 : 1493954385
ISBN 13 : 9781493954384
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book. 340 pp. Englisch. N° de réf. du vendeur 9781493954384
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Wafer-Level Chip-Scale Packaging | Analog and Power Semiconductor Applications
Vendeur : preigu, Osnabrück, Allemagne
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Taschenbuch. Etat : Neu. Wafer-Level Chip-Scale Packaging | Analog and Power Semiconductor Applications | Yong Liu (u. a.) | Taschenbuch | xvii | Englisch | 2016 | Springer New York | EAN 9781493954384 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. N° de réf. du vendeur 107556559
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Wafer-Level Chip-Scale Packaging
Edité par
Springer New York, Springer New York Aug 2016, 2016
ISBN 10 : 1493954385
ISBN 13 : 9781493954384
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 340 pp. Englisch. N° de réf. du vendeur 9781493954384
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Wafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications
Edité par
Springer New York, Springer New York, 2016
ISBN 10 : 1493954385
ISBN 13 : 9781493954384
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book. N° de réf. du vendeur 9781493954384
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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Vendeur : Books Puddle, New York, NY, Etats-Unis
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Etat : New. pp. 339. N° de réf. du vendeur 26378103503
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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
impression à la demandeVendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. Print on Demand pp. 339. N° de réf. du vendeur 385800464
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