Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials (Classic Reprint) - Couverture souple

Baker-Jarvis, James

9781527896680: Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials (Classic Reprint)

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ISBN 10 : 1527896684 ISBN 13 : 9781527896680

Editeur : Forgotten Books, 2018

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�diteur: Forgotten Books
Date d'�dition: 2018
Langue: anglais
ISBN 10: 1527896684
ISBN 13: 9781527896680
Reliure: Broch�
Nombre de pages: 164
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Dielectric and Conductor-Loss Characterization and Measurements on Electronic

James Baker-Jarvis, Michael D. Janezic

Edit� par Forgotten Books, 2024

ISBN 10 : 1527896684 ISBN 13 : 9781527896680

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Vendeur : Forgotten Books, London, Royaume-Uni

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Paperback. Etat : New. Print on Demand. This book provides an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low and high temperature co-fired ceramic substrates, printed wiring boards, and other packaging materials. Most commonly used methods are presented, with particular emphasis on methods that can be used nondestructively either in the laboratory or on the assembly line. The author begins with an overview of pertinent electrical properties of substrate materials and conductors, with a review of the relevant parameters of transmission line theory. Methods for thin materials permittivity measurement are reviewed, as are metal losses in various transmission-line structures. The book discusses cavity and dielectric resonators, full-sheet resonance, coaxial probe, stripline, and capacitive methods. The frequency ranges of applicability and typical uncertainties associated with the methods are summarized. Measurement results for a number of commonly used materials are presented. Thermal properties are overviewed and a technique for measurements at elevated temperatures is given. Measurement results for several commonly used materials are given. This book will be of interest to researchers, technologists, and engineers involved in the design, fabrication, and testing of electronic packaging and interconnects. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item. N� de r�f. du vendeur 9781527896680_0

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