Materials Reliability Issues in Microelectronics: Volume 225 - Couverture rigide

9781558991194: Materials Reliability Issues in Microelectronics: Volume 225

Couverture rigide

ISBN 10 : 1558991190 ISBN 13 : 9781558991194

Editeur : Cambridge University Press, 1991

Afficher les exemplaires de cette �dition comportant l'ISBN

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Les informations fournies dans la section � Synopsis � peuvent faire r�f�rence � une autre �dition de ce titre.

Pr�sentation de l'�diteur

With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.

Les informations fournies dans la section � A propos du livre � peuvent faire r�f�rence � une autre �dition de ce titre.

�diteur: Cambridge University Press
Date d'�dition: 1991
Langue: anglais
ISBN 10: 1558991190
ISBN 13: 9781558991194
Reliure: Reli�
Nombre de pages: 382
�diteur: Lloyd James R., Yost Frederick G., Ho Paul S.
Coordonn�es du fabricant: non disponible
Personne responsable: Avery
https://www.avery.fr/

chemin des peupliers 27
Dardilly
France

R�sultats de recherche pour Materials Reliability Issues in Microelectronics: Volume...

Image d'archives