Materials Reliability in Microelectronics IX: Volume 563 - Couverture rigide

Couverture rigide

ISBN 10 : 155899470X ISBN 13 : 9781558994706

Editeur : Cambridge University Press, 1999

Synopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

A propos du livre

Présentation de l'éditeur

The continual evolution of integrated circuit architecture places ever-increasing demands on the metal and dielectric thin films used in fabricating these circuits. Not only must these materials meet performance and manufacturability requirements, they must also be highly reliable for many years under operating conditions. A thorough understanding of the failure mechanisms and the effect of processing conditions and material properties on reliability is required to achieve this, particularly if it is to be done while minimizing cost and maximizing performance. This book brings together researchers from academia and industry to discuss fundamental mechanisms and phenomena in the reliability field. Topics include: solder and barrier-layer reliability; electromigration modeling; electromigration in interconnects; advanced measurement techniques; mechanical behavior of back-end materials and adhesion and fracture.

Détails de l'édition

• Éditeur: Cambridge University Press
• Date d'édition: 1999
• Langue: anglais
• ISBN 10: 155899470X
• ISBN 13: 9781558994706
• Reliure: Relié
• Nombre de pages: 311
• Éditeur: Volkert Cynthia A., Verbruggen Ad H., Brown Dirk D.
• Coordonnées du fabricant: non disponible
• Personne responsable: Avery; https://www.avery.fr/; ; chemin des peupliers 27; Dardilly; France