Characterization and Metrology for Ulsi Technology: 2000 International Conference - Couverture rigide

Couverture rigide

ISBN 10 : 156396967X ISBN 13 : 9781563969676

Editeur : American Institute of Physics, 2001

Synopsis

The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm. Some of the challenges are materials related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and low-k dielectrics. The magnitude of these challenges demands special attention from those in the metrology and analytical measurements community. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of the process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics.

Détails de l'édition

• Éditeur: American Institute of Physics
• Date d'édition: 2001
• Langue: anglais
• ISBN 10: 156396967X
• ISBN 13: 9781563969676
• Reliure: Relié
• Nombre de pages: 723
• Éditeur: Seiler David G., Diebold Alain C., Shaffner Thomas J., McDonald Robert, Bullis W. Murray, Smith Patrick J., Secula Erik M.
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible