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Three-dimensional Molded Interconnect Devices 3d-mid: Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers - Couverture rigide

 
9781569905517: Three-dimensional Molded Interconnect Devices 3d-mid: Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers
Couverture rigide
ISBN 10 : 1569905517 ISBN 13 : 9781569905517
Editeur : Hanser Publications, 2014

Synopsis

Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies.

MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields.

This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l'auteur

Der Herausgeber des Buches ist Prof. Jörg Franke Er ist Professor an der Friedrich-Alexander-Universität Erlangen-Nürnberg und leitet den Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) seit März 2009. Er ist Vorsitzender des Vorstandes der Forschungsvereinigung Räumliche Elektronische Baugruppen (3-D MID) e.V. und Leiter des Bayerischen Technologiezentrums für elektrische Antriebstechnik (EDrive-Center). In seiner vierzehnjährigen Industriezeit war Prof. Franke u. a. bei McKinsey & Company Inc., Robert Bosch GmbH, ZF Lenksysteme (ZFLS) GmbH, INA Schaeffler KG und zuletzt als Vorsitzender der Geschäftsführung bei ABM Greiffenberger Antriebstechnik GmbH tätig.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Hanser Publications
Date d'édition
2014
Langue
anglais
ISBN 10 
1569905517
ISBN 13 
9781569905517
Reliure
Relié
Nombre de pages
356
Éditeur
Franke Jörg
Coordonnées du fabricant
non disponible
Personne responsable
non disponible