Integrated Interconnect Technologies for 3D Nanoelectronic Systems - Couverture rigide

Bakir, Muhannad; Meindl, James

Couverture rigide

ISBN 10 : 1596932465 ISBN 13 : 9781596932463

Editeur : Artech House Publishers, 2008

Synopsis

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.

A propos du livre

À propos de l?auteur

Muhanned S. Bakir is a research engineer at the Microelectronics Research Center and adjunct professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology. James D. Meindl is the director of the Joseph M. Pettit Microelectronics Research Center and is the founding director of the Nanotechnology Research Center at Georgia Institute of Technology, where he is also the Joseph M. Pettit Chair Professor of Microsystems.

Détails de l'édition

• Éditeur: Artech House Publishers
• Date d'édition: 2008
• Langue: anglais
• ISBN 10: 1596932465
• ISBN 13: 9781596932463
• Reliure: Relié
• Nombre de pages: 550
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible