Wafer-Level Testing and Test During Burn-In for Integrated Circuits - Couverture rigide

Bahukudumbi, Sudarshan; Chakrabarty, Krishnendu

 
9781596939899: Wafer-Level Testing and Test During Burn-In for Integrated Circuits
Couverture rigide
ISBN 10 : 1596939893 ISBN 13 : 9781596939899
Editeur : Artech House Publishers, 2010

Synopsis

Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Éditeur
Artech House Publishers
Date d'édition
2010
Langue
anglais
ISBN 10 
1596939893
ISBN 13 
9781596939899
Reliure
Relié
Nombre de pages
210
Coordonnées du fabricant
non disponible
Personne responsable
non disponible