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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Couverture souple
Synopsis
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
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Présentation de l'éditeur
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)
Edité par
Morgan and Claypool Publishers, 2008
ISBN 10 : 1598292447
ISBN 13 : 9781598292442
Ancien ou d'occasion
Soft Cover
Vendeur : BookOrders, Russell, IA, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Soft Cover. Etat : Good. Ex-library with the usual features. Library label on front cover. The interior is clean and tight. Binding is good. Cover shows light wear. Ex-Library. N° de réf. du vendeur 036024x
Quantité disponible : 1 disponible(s)