Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Couverture souple

Lee, Jong-Hoon

 
9781598292442: Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging
Couverture souple
ISBN 10 : 1598292447 ISBN 13 : 9781598292442
Editeur : Morgan and Claypool Publishers, 2008

Synopsis

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Morgan and Claypool Publishers
Date d'édition
2008
Langue
anglais
ISBN 10 
1598292447
ISBN 13 
9781598292442
Reliure
Broché
Nombre de pages
108
Coordonnées du fabricant
non disponible
Personne responsable
non disponible

Autres éditions populaires du même titre

9783031028311: Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

Edition présentée

ISBN 10 :  3031028317 ISBN 13 :  9783031028311
Editeur : Springer, 2008
Couverture souple