Passive RF Component Technology: Materials, Techniques, and Applications - Couverture rigide

Pan, Bo; Wang, Guoan

Couverture rigide

ISBN 10 : 1608071995 ISBN 13 : 9781608071999

Editeur : Artech House Publishers, 2011

Synopsis

This forward-looking resource presents the latest details on smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications. Engineers find comprehensive details on LCP (liquid crystal polymers), metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives.

A propos du livre

À propos de l'auteur

Guoan Wang is an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology. Bo Pan is a senior RF engineer at Realtek Semiconductor Corporation in Irvine, California. He holds an M.S. in electrical engineering from Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.

Détails de l'édition

• Éditeur: Artech House Publishers
• Date d'édition: 2011
• Langue: anglais
• ISBN 10: 1608071995
• ISBN 13: 9781608071999
• Reliure: Relié
• Nombre de pages: 290
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible